TE Connectivity | TEL - Zinsaufwendungen Für Schuld





Zinsaufwendungen Für Schuld Veränderung Datum
3M USD 202M 12M 2026-06
Acuity Brands USD 7.8M 900K 2026-03
Amphenol USD 213.7M 5.8M 2026-06
Apple USD 377M 98M 2025-09
Aptiv USD 62M 27M 2026-06
Arista Networks USD 110.8M 25.8M 2026-03
Arrow Electronics USD 69.48M 29.01B 2026-03
Belden USD 13.6M 140K 2026-06
Borgwarner USD 13.93B 281M 2026-06
Broadcom USD 807M 49M 2026-03
Carlisle Companies USD 27.4M 900K 2026-06
Ciena USD 20.92M 332K 2026-03
Cisco Systems USD 370M 20M 2025-12
CommScope USD 153.1M 17.8M 2025-12
Corning USD 94M 2M 2026-06
Emerson Electric USD 85M 25M 2026-06
F5 Networks USD 6.83B 331.6M 2026-06
Gentex USD 3B 1.79M 2026-06
Hewlett Packard USD 101M 24M 2025-12
Honeywell International USD 77.34B 3.36B 2026-06
HP USD 99M 2M 2025-12
Hubbell USD 22M 200K 2026-03
Jabil Circuit USD 63M 5M 2025-09
Keysight Technologies USD 25M 4M 2026-03
Lear USD 25.6M 600K 2026-03
Littelfuse USD 5.74M 1.24M 2026-06
Microchip Technology USD 48.8M 2.9M 2026-06
NetApp USD 21M 9M 2025-03
Plexus USD 4.09M 667K 2026-06
Rockwell Automation USD 33M 3M 2026-06
Roper Industries USD 93.3M 3.6M 2025-12
Seagate Technology USD 68M 4M 2026-03
Sensata Technologies USD 32.8M 1.3M 2026-06
Snap-On USD 12.4M 1000K 2026-03
Sumitomo JPY 22.66B 6.47B 2025-09
TE Connectivity USD 31M 1000K 2026-06
Tesla USD 92M 7M 2026-03
Texas Instruments USD 141M 0 2026-06
TTM Technologies USD 10.6M 1.78M 2026-03
Visteon USD 3M 0 2026-03
Western Digital USD 38M 16M 2026-03